陳松德的數位歷程檔

基本資料

姓名:	陳松德
系所:	修平科技大學 / 電子工程系 [數位教學紀錄]

自我介紹

修平科技大學電子工程系

個人著作

期刊論文

1.	陳松德, "Activation of amino-based monolayers for electroless metallization of high-aspect-ratio through-silicon vias by using a simple ultrasonic-assisted plating solution [Applied Surface Science]," , 2018.
2.	陳松德, "Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers [Applied Surface Science ]," , 2017.
3.	陳松德, "Electroless plating of low-resistivity Cu–Mn alloy thin films with self-forming capacity and enhanced thermal stability [Journal of Alloys and Compounds]," , 2015.
4.	陳松德, "Ultrathin cobalt-alloyed barrier layers for copper metallization by a new seeding and electroless-deposition process [Applied Surface Science]," , 2015.
5.	陳松德, "無電鍍銅錳合金薄膜抑制高溫誘發團聚行為研究 [修平學報]," , 2013.
6.	陳松德, "Site-selective electroless metallization on porous organosilica films by multisurface modification of alkyl monolayer and vacuum plasma [Langmuir]," , 2012.
7.	陳松德, "Synergetic effect of vacuum-plasma and solution-colloidal seeding process for the fabrication of nanostructured barrier layers [Electrochemistry Communications]," , 2012.
8.	陳松德, "Nanoseeding via Dual Surface Modification of Alkyl Monolayer for Site-controlled Electroless Metallization [Langmuir]," , 2011.
9.	陳松德, "A new seeding and electroless approach to alloying, direct patterning, and self-forming barriers for Cu thin-film nanostructures [Electrochem. Commun.,]," , 2011.
10.	陳松德, "奈米積體電路薄膜元件之真空電漿表面改質與全程電化學孔渠填充研究 [真空科技]," , 2011.
11.	陳松德, "A vacuum plasma surface pretreatment for refining seeding of Co in electroless copper plating [Thin Solid Films]," , 2010.
12.	陳松德, "Growth of ultrathin barrier layers by sub-5-nm metallic seeds using sequent treatments of vacuum plasma and electrochemical solution [Vacuum]," , 2009.
13.	陳松德, "奈米電子元件之銅金屬化薄膜製程技術 [國家奈米元件實驗室奈米通訊]," , 2009.
14.	陳松德, "Electroless deposition of ultrathin Co-B based barriers for Cu metallization using an innovative seeding technique [Electrochemical and Solid-State Letters]," , 2006.
15.	陳松德, "Electroles deposition of ultrathin Co-B based barriers for Cu metallization using an innovative seeding technique [ELECTROCHEMICAL AND SOLID STATE LETTERS]," , 2006.
16.	陳松德, "創新性無電鍍沉積超薄鈷基阻障層在銅金屬化之應用 [真空科技]," , 2006.
17.	陳松德, "Influence of adding Mesocarbon Microbeads into c/c composites on microstructure and properties during carbonization [Journal of Electroceramics]," , 2006.
18.	陳松德, "Self-Aligned Deposition process for ultrathin electroless barriers and copper films on low-k dielectric films [Electrochem. Solid-State Lett.,]," , 2004.
19.	陳松德, "Characterization of ultra-thin electroless barriers grown by a self-aligned deposition process on silicon-based dielectric films [J. Electrochem. Soc.,]," , 2004.
20.	陳松德, "Strengthening electroless Co-based barrier layers [Thin Solid Films]," , 0007.

國內會議論文

1.	陳松德, "Self-Aligned Electroless Metallization on Polyimide using Dual Surface Modification of Seeding Technique [2017 2nd International Conference on Nanotechnology and Nanomaterials in Energ]," , 2017.
2.	陳松德, "Immobilization of catalysts by self-assembled monolayer for electroless copper plating on the tantalum-based barrier layer [Third International Conference on Advanced Complex Inorganic Nanomaterials]," , 2015.
3.	陳松德, "Immobilization of catalysts by self-assembled monolayer for electroless copper plating on the tantalum-based barrier layer [The 3rd International Conference on Advanced Complex Inorganic Nanomaterials,]," , 2015.
4.	陳松德, "Inhibition of thermal-induced copper agglomeration using the electroless Cu alloy films with minute amounts of Mn-doping [The International Conference on Technological Advances of Thin Films & Surface Coatings 20," , 2014.
5.	陳松德, "Ultrathin cobalt-alloyed barrier layers for copper metallization by all-wet seeding and electroless deposition [The 7th Vacuum and Surface Sciences Conference of Asia and Australia]," , 2014.
6.	陳松德, "控制式的烷基單層控制式的烷基單層雙重表面改質以促成雙重表面改質以促成雙重表面改質以促成奈米晶種暨無電鍍金屬化圖案無電鍍金屬化圖案 [台灣真空學會2012年度會員大會暨論文發表會]," , 2012.
7.	陳松德, "Surface multi-treatments of nanoporous SiO2-derived dielectriclayers for electrochemically-plated copper metallization [The 6th International Conference on Technological Advances of Thin Films & Surface Coatings ," , 2012.

計畫

1. 鈷金屬化薄膜工程---後銅時代之後段導線完整解決方案 (2020-08 ~ 2021-10)
2. 電場輔助原創技術在次世代銅製程之應用(2/2) (2018-08 ~ 2019-07)
3. 電場輔助原創技術在次世代銅製程之應用(2/2) (2017-08 ~ 2018-07)
4. 次世代SiOC:H孔隙介電材料之緻密晶種與超微無電鍍銅薄膜導線生長 (2016-08 ~ 2017-07)
5. 多功能性自組裝單層技術在孔隙介電層材料之銅金屬化暨溝槽鑲嵌應用 (2014-08 ~ 2015-07)
6. 奈米壓印孔隙介電層之多重表層改質暨超微銅薄膜導線之整合研究 (2013-08 ~ 2014-07)
7. 直接壓印型奈米孔隙介電層之多重表層改質暨無電鍍超填充微薄銅膜導<br/>線之整合研究 (2012-08 ~ 2013-07)
8. 雙重鈍化及新型固定化晶種在奈米孔隙介電層/無電鍍銅合金薄膜導線之應用性 (2011-08 ~ 2012-07)
9. 次世代技術節點之自我完全鈍化型無電鍍銅合金化導線薄膜研發 (2009-08 ~ 2010-07)
10. 應用在薄膜太陽能電池之ZnO：Al材料性質研究 (2009-05 ~ 2010-04)
11. CIGS薄膜製程之顯微之結構研究 (2008-04 ~ 2009-03)
12. 97年度教育部補助影像顯示科技人才培育計畫-科目課程計畫-平面顯示器製程技術 (2008-02 ~ 2009-01)
13. 自我對位與自我鈍化雙合金化全程電化學析鍍技術在下世代銅金屬化製程研究 (2007-08 ~ 2008-07)
14. 應用在太陽能電池之銅銦硫硒化合物薄膜開發 (2007-04 ~ 2007-12)
15. 次65nm世代元件之關鍵奈米催化晶種與孔槽膠囊化銅嵌製程研發 (2006-08 ~ 2007-07)
16. 奈米孔隙介電層與超細微無電鍍Cu基多元合金強韌薄膜導線之整合特性

獲獎榮譽

1. 中華民國私立教育事業協會資深暨優良教師獎 (2017-09)
2. 工程學院電子工程系105學年度第一學期應屆畢業班專題製作成果競賽 (2016-12)
3. 2016全國電腦輔助電路版設計技能競賽 (2016-12)
4. 東京威力科創機器人大賽 (2016-11)
5. 104學年度第一學期5S競賽考評 (2016-06)
6. TEMI_電子元件拆銲能力認證專家級_甲級證照[TUE16002換] (2016-02)
7. 應屆畢業班實務專題競賽 (2015-12)
8. 應屆畢業班實務專題競賽 (2015-12)
9. 實驗（習）室5S競賽 (2015-12)
10. 全國電腦輔助電路板設計技能競賽大專組 (2015-12)
11. 104年5S競賽 (2015-12)
12. TEMI單晶片創意暨認證技能競賽（台灣選拔賽） (2015-07)
13. TEMI單晶片創意暨認證技能競賽（台灣選拔賽） (2015-06)
14. TEMI單晶片創意暨認證技能競賽（台灣選拔賽） (2015-06)
15. 創意校園文化-2015全國LED創意設計競賽 (2015-03)
16. 應屆畢業班實務專題競賽 (2014-12)
17. 實驗（習）室5S競賽 (2014-12)
18. 2014全國電腦輔助電路板設計技能競賽 (2014-11)
19. 低成本智慧型LED植物生長系統 (2014-05)
20. 應屆畢業班實務專題競賽 (2014-05)
21. 創意校園文化-2015全國LED創意設計競賽 (2014-03)
22. 2014全國LED創意設計競賽 (2014-02)
23. 畢業班專題製作成果競賽 (2013-12)
24. 畢業班專題製作成果競賽 (2013-12)
25. 薄型天線研製 (2013-12)
26. 2013全國電腦輔助電路板設計技能競賽 (2013-11)
27. 實驗(習)室5S管理考評 (2013-10)
28. 5S管理考評競賽 (2013-10)
29. 2012全國LED創意設計競賽 (2013-02)
30. 95年度真空年會論文獎佳作獎 (2007-01)
31. ９４年度真空年會論文獎優等獎 (2006-02)
32. 台灣嵌入式暨單晶片系統發展協會_電子元件拆與銲能力認證專業級[TUB110163] (1783-08)
33. 台灣嵌入式暨單晶片系統發展協會_電子元件拆與銲能力認證監評委員合格證[TUBF11160] (1783-08)