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期刊論文
1. 陳松德, "Activation of amino-based monolayers for electroless metallization of high-aspect-ratio through-silicon vias by using a simple ultrasonic-assisted plating solution [Applied Surface Science]," , 2018.
2. 陳松德, "Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers [Applied Surface Science ]," , 2017.
3. 陳松德, "Electroless plating of low-resistivity Cu–Mn alloy thin films with self-forming capacity and enhanced thermal stability [Journal of Alloys and Compounds]," , 2015.
4. 陳松德, "Ultrathin cobalt-alloyed barrier layers for copper metallization by a new seeding and electroless-deposition process [Applied Surface Science]," , 2015.
5. 陳松德, "無電鍍銅錳合金薄膜抑制高溫誘發團聚行為研究 [修平學報]," , 2013.
6. 陳松德, "Site-selective electroless metallization on porous organosilica films by multisurface modification of alkyl monolayer and vacuum plasma [Langmuir]," , 2012.
7. 陳松德, "Synergetic effect of vacuum-plasma and solution-colloidal seeding process for the fabrication of nanostructured barrier layers [Electrochemistry Communications]," , 2012.
8. 陳松德, "Nanoseeding via Dual Surface Modification of Alkyl Monolayer for Site-controlled Electroless Metallization [Langmuir]," , 2011.
9. 陳松德, "A new seeding and electroless approach to alloying, direct patterning, and self-forming barriers for Cu thin-film nanostructures [Electrochem. Commun.,]," , 2011.
10. 陳松德, "奈米積體電路薄膜元件之真空電漿表面改質與全程電化學孔渠填充研究 [真空科技]," , 2011.
11. 陳松德, "A vacuum plasma surface pretreatment for refining seeding of Co in electroless copper plating [Thin Solid Films]," , 2010.
12. 陳松德, "Growth of ultrathin barrier layers by sub-5-nm metallic seeds using sequent treatments of vacuum plasma and electrochemical solution [Vacuum]," , 2009.
13. 陳松德, "奈米電子元件之銅金屬化薄膜製程技術 [國家奈米元件實驗室奈米通訊]," , 2009.
14. 陳松德, "Electroless deposition of ultrathin Co-B based barriers for Cu metallization using an innovative seeding technique [Electrochemical and Solid-State Letters]," , 2006.
15. 陳松德, "Electroles deposition of ultrathin Co-B based barriers for Cu metallization using an innovative seeding technique [ELECTROCHEMICAL AND SOLID STATE LETTERS]," , 2006.
16. 陳松德, "創新性無電鍍沉積超薄鈷基阻障層在銅金屬化之應用 [真空科技]," , 2006.
17. 陳松德, "Influence of adding Mesocarbon Microbeads into c/c composites on microstructure and properties during carbonization [Journal of Electroceramics]," , 2006.
18. 陳松德, "Self-Aligned Deposition process for ultrathin electroless barriers and copper films on low-k dielectric films [Electrochem. Solid-State Lett.,]," , 2004.
19. 陳松德, "Characterization of ultra-thin electroless barriers grown by a self-aligned deposition process on silicon-based dielectric films [J. Electrochem. Soc.,]," , 2004.
20. 陳松德, "Strengthening electroless Co-based barrier layers [Thin Solid Films]," , 0007.
國內會議論文
1. 陳松德, "Self-Aligned Electroless Metallization on Polyimide using Dual Surface Modification of Seeding Technique [2017 2nd International Conference on Nanotechnology and Nanomaterials in Energ]," , 2017.
2. 陳松德, "Immobilization of catalysts by self-assembled monolayer for electroless copper plating on the tantalum-based barrier layer [Third International Conference on Advanced Complex Inorganic Nanomaterials]," , 2015.
3. 陳松德, "Immobilization of catalysts by self-assembled monolayer for electroless copper plating on the tantalum-based barrier layer [The 3rd International Conference on Advanced Complex Inorganic Nanomaterials,]," , 2015.
4. 陳松德, "Inhibition of thermal-induced copper agglomeration using the electroless Cu alloy films with minute amounts of Mn-doping [The International Conference on Technological Advances of Thin Films & Surface Coatings 20," , 2014.
5. 陳松德, "Ultrathin cobalt-alloyed barrier layers for copper metallization by all-wet seeding and electroless deposition [The 7th Vacuum and Surface Sciences Conference of Asia and Australia]," , 2014.
6. 陳松德, "控制式的烷基單層 控制式的烷基單層 雙重表面改質以促成 雙重表面改質以促成 雙重表面改質以促成 奈米晶種 暨無電鍍金屬化圖案 無電鍍金屬化圖案 [台灣真空學會2012年度會員大會暨論文發表會]," , 2012.
7. 陳松德, "Surface multi-treatments of nanoporous SiO2-derived dielectriclayers for electrochemically-plated copper metallization [The 6th International Conference on Technological Advances of Thin Films & Surface Coatings ," , 2012.